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History
- March 18, 2023.
Copyright
The copyright holder for this preprint is the author/funder, who has granted medRxiv a license to display the preprint in perpetuity. All rights reserved. No reuse allowed without permission.
Author Information
- Jinyun Yuan1,#,
- Lu Xu1,#,
- Chih-Yen Chien1,#,
- Yaoheng Yang1,
- Yimei Yue1,
- Siaka Fadera1,
- Andrew H. Stark1,
- Katherine E. Schwetye2,
- Arash Nazeri3,4,
- Rupen Desai5,
- Umeshkumar Athiraman6,
- Aadel A. Chaudhuri1,7,8,9,10,
- Hong Chen1,5,11,*,† and
- Eric C. Leuthardt1,5,12,13,14,*
- 1Department of Biomedical Engineering, Washington University in St. Louis, Saint Louis, MO 63130, USA
- 2Department of Pathology and Immunology, Washington University School of Medicine, Saint Louis, MO, 63110, USA
- 3Mallinckrodt Institute of Radiology, Washington University School of Medicine, Saint Louis, MO, 63110, USA
- 4Brain Health Imaging Centre, Campbell Family Mental Health Research Institute, Centre for Addiction and Mental Health University of Toronto, Toronto, Ontario, M5T 1R8, Canada
- 5Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO, 63110, USA
- 6Department of Anesthesia, Washington University School of Medicine, St. Louis, MO, 63110
- 7Department of Radiation Oncology, Washington University School of Medicine, Saint Louis, MO 63108, USA
- 8Department of Genetics, Washington University School of Medicine, St. Louis, MO, 63110, USA
- 9Department of Computer Science and Engineering, Washington University in St. Louis, Saint Louis, MO 63130, USA
- 10Siteman Cancer Center, Washington University School of Medicine, St. Louis, MO, 63110, USA
- 11Division of Neurotechnology, Department of Neurosurgery, Washington University School of Medicine, Saint Louis, MO, 63110, USA
- 12Department of Neuroscience, Washington University School of Medicine, Saint Louis, MO, 63110, USA
- 13Center for Innovation in Neuroscience and Technology, Washington University School of Medicine, Saint Louis, MO, 63110, USA
- 14Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, Saint Louis, MO 63130, USA
- ↵†Corresponding author; email: hongchen{at}wustl.edu
↵# These authors contributed equally to the study.