User profiles for Shinji Yokogawa

Shinji Yokogawa

The University of Electro-Communications
Verified email at uec.ac.jp
Cited by 1142

Experimental investigation to verify if excessive plastic sheeting shielding produce micro clusters of SARS-CoV-2

Y Ishigaki, Y Kawauchi, S Yokogawa, A Saito… - medRxiv, 2021 - medrxiv.org
We experimentally investigated indoor air ventilation using the CO 2 tracer technique to
verify the infection cluster of SARS-CoV-2 that erupted at an office space. Multi-placed …

Liner-and barrier-free NiAl metallization: A perspective from TDDB reliability and interface status

L Chen, D Ando, Y Sutou, S Yokogawa, J Koike - Applied Surface Science, 2019 - Elsevier
This study reports the time-dependent-dielectric-breakdown (TDDB) reliability of NiAl on
SiO 2 without any barrier layer. NiAl was indicated to exhibit superior TDDB reliability in …

Electromigration lifetimes and void growth at low cumulative failure probability

H Tsuchiya, S Yokogawa - Microelectronics Reliability, 2006 - Elsevier
We have investigated electromigration (EM) lifetimes and void formation at cumulative failure
probability of around 50 ppm. We carried out EM test in damascene Cu lines using sudden-…

Statistical modeling of V th distribution in ovonic threshold switches based on physical switching models

S Yokogawa - Japanese Journal of Applied Physics, 2023 - iopscience.iop.org
This paper discusses the statistical modeling of the V th distribution of an ovonic threshold
switch, an integral component of high-speed, high-capacity storage-class memory. A …

An approach to renewable-energy dominant grids via distributed electrical energy platform for IoT systems

H Ichikawa, S Yokogawa, Y Kawakita… - … for Smart Grids …, 2019 - ieeexplore.ieee.org
Increasing the proportion of renewable energy- particularly solar energy-in global energy
consumption will increase the electricity generated and consumed in the vicinity of consumers …

Scaling Impacts on Electromigration in Narrow Single‐Damascene Cu Interconnects

S Yokogawa, H Tsuchiya - AIP Conference Proceedings, 2004 - pubs.aip.org
This paper presents scaling impacts on electromigration‐induced mass transport in narrow
single damascene Cu interconnects. The Kawasaki‐Hu test structure was used to investigate …

Effects of Al doping on the electromigration performance of damascene Cu interconnects

S Yokogawa, H Tsuchiya - Journal of Applied Physics, 2007 - pubs.aip.org
We report the effects of Al doping on electromigration in damascene Cu interconnects. Al
doping was performed by thermal diffusion from a CuAl seed layer positioned underneath the …

[HTML][HTML] Ventilation improvement and evaluation of its effectiveness in a Japanese manufacturing factory

H Kitamura, Y Ishigaki, H Ohashi, S Yokogawa - Scientific Reports, 2022 - nature.com
A coronavirus disease 2019 (COVID-19) cluster emerged in a manufacturing factory in early
August 2021. In November 2021, we conducted a ventilation survey using the tracer gas …

Analysis of Al doping effects on resistivity and electromigration of copper interconnects

S Yokogawa, H Tsuchiya, Y Kakuhara… - IEEE Transactions on …, 2008 - ieeexplore.ieee.org
In this paper, we investigated the effect of impurity (aluminum; Al) doping on the resistivity of
damascene copper (Cu) interconnects by categorizing it into surface, grain-boundary, and …

Statistics of breakdown field and time-dependent dielectric breakdown in contact-to-poly modules

S Yokogawa, S Uno, I Kato, H Tsuchiya… - 2011 International …, 2011 - ieeexplore.ieee.org
In this paper, we present the results of voltage-ramp dielectric breakdown and time-dependent
dielectric breakdown experiments for contact-polysilicon control gate intra-level dielectric …