User profiles for Max Bloomfield

Max Bloomfield

Rensselaer Polytechnic Institute
Verified email at rpi.edu
Cited by 469

Efficacy of Early Oral Switch with β-Lactams for Low-Risk Staphylococcus aureus Bacteremia

…, T Blackmore, M Bloomfield - Antimicrobial Agents and …, 2020 - Am Soc Microbiol
The aim of this study was to assess the safety of early oral switch (EOS) prior to 14 days for
low-risk Staphylococcus aureus bacteremia (LR-SAB), which is the primary treatment strategy …

Modeling thermal stresses in 3-D IC interwafer interconnects

J Zhang, MO Bloomfield, JQ Lu… - IEEE transactions on …, 2006 - ieeexplore.ieee.org
We present a finite-element-based analysis to determine if there are potential reliability
concerns due to thermally induced stresses in interwafer copper via structures in three-…

Early oral antibiotic switch in Staphylococcus aureus bacteraemia: The Staphylococcus aureus Network Adaptive Platform (SNAP) Trial Early Oral Switch Protocol

D de Kretser, J Mora, M Bloomfield… - Clinical Infectious …, 2023 - researchers.cdu.edu.au
Staphylococcus aureus bloodstream infection (bacteraemia) is traditionally treated with at
least two weeks of IV antibiotics in adults, 3-7 days in children, and often longer for those with …

Benzoyl peroxide + chlorhexidine versus chlorhexidine alone skin preparation to reduce Propionibacterium acnes: a randomized controlled trial

…, I Elkinson, MG Bloomfield… - ANZ Journal of …, 2018 - Wiley Online Library
Background Traditional skin preparation for shoulder surgery is not specific for Propionibacterium
acnes. Topical benzoyl peroxide for 48 h preoperatively has been shown to reduce the …

Thermal stresses in 3D IC inter-wafer interconnects

J Zhang, MO Bloomfield, JQ Lu, RJ Gutmann… - Microelectronic …, 2005 - Elsevier
We present a finite element based analysis to determine if thermally induced stresses in
inter-wafer Cu via structures in 3D ICs using BCB-bonded wafers is a potential reliability problem…

Passivity-based iterative learning control design for selective laser melting

…, Y Guo, S Roy, MO Bloomfield… - 2018 Annual …, 2018 - ieeexplore.ieee.org
Selective laser melting (SLM) is an additive manufacturing process that creates 3D parts
through layer by layer melting and fusion of a metal powder bed. Although a number of finite …

Thermomechanical behavior of EUV pellicle under dynamic exposure conditions

DL Goldfarb, MO Bloomfield… - Extreme Ultraviolet (EUV …, 2016 - spiedigitallibrary.org
The utilization of EUV pellicles as protective layers for EUV masks requires the use of
refractory materials that can tolerate large temperature excursions due to the non-negligible …

A computational framework for modelling grain-structure evolution in three dimensions

MO Bloomfield, DF Richards, TS Cale - Philosophical Magazine, 2003 - Taylor & Francis
We describe a simulation framework designed to track individual grains in a material during
simulations of formation, processing and usage. The framework, which we call parallel level-…

Antimicrobial stewardship in human healthcare in Aotearoa New Zealand: urgent call for national leadership and co-ordinated efforts to preserve antimicrobial …

…, B Betty, M Birch, TK Blackmore, M Bloomfield… - 2021 - researchspace.auckland.ac.nz
immense threat to human health. Within 30 years, the global number of deaths from AMR-associated
infections is predicted to increase from~ 700,000 to~ 10 million people annually, if …

Modeling pattern density dependent bump formation in copper electrochemical deposition

YH Im, MO Bloomfield, S Sen… - Electrochemical and solid …, 2003 - iopscience.iop.org
A model and simulator that describe the dependence of deposition rate and bump formation
on pattern density during electrochemical deposition (ECD) are presented. A curvature-…